Fairphone 6 Leak Details Modular Accessories and Affordable Repairable Design

The upcoming Fairphone 6, expected to launch on June 25, 2025, will feature a more modular and customizable design according to leaked information shared by WinFuture. In keeping with Fairphone’s reputation for creating environmentally-conscious, repair-friendly smartphones, the new model will offer support for interchangeable accessories including a card holder, lanyard, and ring grip — similar to those seen on other modular devices like the CMF Phone 1. The phone will feature a two-part rear casing that allows users to mix and match colors, with black, white, and green as initial options. Specs include 8GB of RAM and 256GB of internal storage, and the phone will be priced at €549.99 (around $625), marking a notable price drop from the €699 Fairphone 5. Like its predecessors, the Fairphone 6 is user-repairable, with parts available for components such as the display, cameras, speaker, battery, USB-C port, and earpiece. Although the Fairphone 5 did not release in the U.S., there is hope the new model might reach that market. This leak reinforces Fairphone’s continued focus on sustainability and user empowerment through repairability and modular design.