China’s Challenges and Efforts in Reverse-Engineering ASML Lithography Technology

Recent reports indicate that Chinese technicians attempting to reverse-engineer an ASML deep ultraviolet lithography machine experienced a breakdown during the process. ASML, a Dutch company, produces highly advanced chipmaking technology that China has been restricted from accessing due to US and allied export controls. These restrictions include bans on new machine sales, software updates, and spare parts for existing equipment, severely limiting China’s ability to acquire or maintain cutting-edge semiconductor manufacturing machines. In response, China has focused on developing indigenous capabilities through startups like SECAR and state-owned firms such as SMEE and AMIES. Despite significant progress in advancing legacy DUV technology and achieving commercial prototypes, China still lags behind in extreme ultraviolet (EUV) lithography, critical for producing state-of-the-art chips below 7 nanometers. The broader context reveals the intensifying technology conflict between China and Western nations, with repercussions for global semiconductor supply chains and market dynamics. The breakdown of the lithography machine during reverse engineering symbolizes the technical hurdles China faces in its efforts toward semiconductor self-sufficiency amid sanctions and export restrictions.